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1 groove isolation
ізоляція (витравленими) канавкамиEnglish-Ukrainian dictionary of microelectronics > groove isolation
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2 V-groove isolation
ізоляція V-подібними канавкамиEnglish-Ukrainian dictionary of microelectronics > V-groove isolation
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3 V-groove isolation polycrystal backfill
заповнення V-подібних ізолюючих канавок полікристалічним кремніємEnglish-Ukrainian dictionary of microelectronics > V-groove isolation polycrystal backfill
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4 isolation
1) ізоляція 2) рідк. ізолююча область - air-охide isolation
- base-diffusion isolation
- ceramic isolation
- collector-diffusion isolation
- deep охide isolation
- deep trench isolation
- device isolation
- dielectric isolation
- diffused-junctionisolation
- diffusedisolation
- diode-typeisolation
- diodeisolation
- double-polysiliconisolation
- double-polyisolation
- epitaxial isolation
- etch-out and backfill isolation
- fully-enclosed air isolation
- glass isolation
- groove isolation
- half-sunk isolation
- interdevice isolation
- ion-implanted охide isolation
- isoplanar isolation
- junction isolation
- lateral isolation
- local-охide isolation
- mesa isolation
- oxide isolation
- passive isolation
- p-i-n isolation
- polycrystal isolation
- post fabrication isolation
- proton bombardment isolation
- proton isolation
- recessed dielectric isolation
- resistive isolation
- reverse-biased junction isolation
- reverse-biased isolation
- semirecessed oxide isolation
- sidewall masked isolation
- source-drain isolation
- standard buried collector isolation
- V-groove isolationEnglish-Ukrainian dictionary of microelectronics > isolation
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5 groove
1. ім. канавка; заглиблення 2. дієсл. формувати канавки - gate groove
- isolation groove
- V -shaped groove
- V groove -
6 isolation groove
ізолююча канавкаEnglish-Ukrainian dictionary of microelectronics > isolation groove
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7 backfill
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8 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
9 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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10 structure
1. ім. структура; конструкція 2. дієсл. формувати структуру - array structure
- band structure
- basic structure
- bilevel structure
- bipolar structure
- bridge structure
- charge-coupled device structure
- charge-coupled structure
- charge-transfer device structure
- charge-transfer structure
- chip structure
- CMOS structure
- contiguous-disk propagating structure
- data structure
- delta-type doping structure
- disordered structure
- double-barrier parabolic well structure
- double-implanted structure
- functional structure
- gate structure
- graded structure
- heterogeneous structure
- heterojunction structure
- homogeneous structure
- implanted structure
- insulated substrate structure
- integrated circuit structure
- integrated structure
- interconnection structure
- interdigital collector structure
- interface structure
- isolation-moat structure
- Josephson-effect structure
- junction-isolated structure
- latchup resistant structure
- lateral structure
- lateral transistor structure
- lattice structure
- lattice-strained structure
- lead structure
- logic structure
- MAS structure
- mask structure
- merged structure
- mesa -type structure
- mesa structure
- MIM structure
- MIS structure
- MNOS structure
- monolithic-typestructure
- monolithicstructure
- MOS structure
- MSM structure
- MTOS structure
- multigate structure
- multilayer structure
- multilevel structure
- nonhomogeneous-base structure
- n-p-n structure
- nonresonant surface реriodical structure
- oxide-isolated structure
- pin structure
- planar structure
- planar superlattice structure
- p-n-p structure
- polycrystalline resistor structure
- propagating structure
- quantum-box structure
- quantum well structure
- quasi-one dimensional structure
- recessed structure
- regular crystal structure
- self-aligned gate structure
- self-registered gate structure
- semiconductor structure
- semi-ROX structure
- series-gated structure
- shallow chip structure
- shield structure
- short-channel device structure
- short-channel structure
- SIC structure
- silicide-on-polysilicon structure
- silicon-in-sapphire structure
- silicon-on- insulator structure
- silicon- insulator structure
- silicon-on-sapphire structure
- silicon-on-spinel structure
- silicon-over oxide-semiconductor structure
- single-crystal structure
- slow-wave structure
- sphalerite-type structure
- submicrometer structure
- superlattice structure
- surface periodical structure
- test structure
- tiered structure
- totally ordered structure
- trench structure
- trench-gate structure
- trench isolation structure
- triple-diffusion structure
- triple-poly structure
- twin-well structure
- ultra-small structure
- unipolar structure
- van der Pauw structure
- vertical injector structure
- vertically integrated structure
- V-groove structure
- wafer асceptance test structure
- wiring layer structure
- zinc blende structureEnglish-Ukrainian dictionary of microelectronics > structure
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11 device
1) прилад (напр. ІС, транзистор, діод); компонент; елемент 2) пристрій - active device
- add-on device
- analog device
- array device
- attached device
- backup device
- beam-leadeddevice
- beam-leaddevice
- bipolar device
- bipolar-MOS device
- blown-fuse device
- bubble-domain device
- bubble- device
- bucket-brigade device
- bulk асoustic-wave device
- bulk-channel carrier-transfer device
- bulk-effect device
- carrier-transfer device
- charge-coupled device
- charge-domain device
- charge-injection device
- charge-priming device
- charge-transfer device
- chip-and-wire device
- CMOS device
- CMOS/SOS device
- compound-semiconductor device
- contiguous-disk device
- controlled surface device
- custom-designed device
- custom device
- dense device
- depletion-modedevice
- depletiondevice
- dielectric isolation device
- diffused device
- discrete device
- double-diffused MOS device
- elastic-surface-wave device
- electrooptic device
- elementary device
- enchancement-mode device
- enchancement device
- end-use device
- epiplanar device
- epitaxial device
- FAMOS device
- field-effect device
- field-programmable device
- FIMOS device
- functional device
- graded-gap semiconductor device
- graded-gap device
- Gurm-effect device
- Gurm device
- Hall-effectdevice
- Halldevice
- hardeneddevice
- harddevice
- heteroepitaxial device
- heterojunction device
- high-gain device
- high-immunity noise device
- high-technology device
- high-threshold device
- homojunction device
- hybrid high-power device
- identification device
- I2L device
- image [imaging] device
- IMPATT device
- implanted device
- integrated-optic device
- integrated semiconductor device
- integration device
- interdigitated device
- interface device
- Josephson-junctiondevice
- Josephsondevice
- Josephson logic device
- junction-isolated device
- large-scale integrated device
- large-scale integration device
- latch-up free CMOS device
- leaded device
- leadless inverted device
- light-wave device
- locked-in device
- logic array device
- low-power Schottky device
- magnetostatic-wave device
- majority-carrier device
- mask-programmable device
- metal-masked device
- metal-semiconductor device
- microdiscrete device
- microelectronic device
- minority-carrier device
- MIS-type device
- MIS device
- mixed-process device
- mixed device
- molecular-beam epitaxy-based device
- monolithic device
- MOS device
- MTL device
- multilayered device
- multilevel device
- n-channel MOS device
- n-channel device
- negative-resistance device
- non-CPU device
- n–p–n device
- off-chip device
- on-chip device
- optocoupler semiconductor device
- optocoupling device
- passive device
- p-channel MOS device
- p-channel device
- peripheral device
- permalloy bubble device
- permalloy T-bar device
- photo-coupled semiconductor device
- photosensitive device
- piezoelectric device
- piggyback device
- planar device
- plotting device
- plug-in device
- p-n-p device
- positioning device
- printing device
- programmable logic-array device
- programmable device
- quantum device
- quantum-well device
- redundancy device
- resin-molded device
- SAW device
- SAW delay device
- scaled-downdevice
- scaleddevice
- Schottky-barrier device
- Schottky device
- second-source device
- self-aligned semiconductor device
- semiconductor-on-sapphire
- silicon-on-dielectric device
- silicon-on-insulator device
- silicon-on-sapphire device
- single device
- single-crystal device
- slow device
- SLS device
- small-geometry device
- solder-evacuator device
- SOS/MOS device
- stacked semiconductor device
- static-sensitive device
- stripeline device
- submicron-scale MOS device
- superconducting Josephson-junction device
- superconducting quantum interference device
- superconductive quantum interferometric device
- super-lattice functional device
- superstructure device
- surface-acoustic-wave device
- surface charge-transfer device
- surface-mounted device
- switching device
- TAB device
- thermocompression bonded device
- thick-film device
- thin-film device
- transcalent device
- transferred-electron device
- transil-time-negative-resistance device
- trench isolated device
- tunnel -еffect device
- tunnel device
- two-level polysilicon MOS device
- ULA device
- ultrafine-scale device
- ultra-large-scale integrated device
- ultra-submicron device
- uncased device
- vertical-junction device
- very large-scale integrated-circuit device
- very large-scale integration device
- V-groove MOS device
- V-groove device
- wafer-printing device -
12 capacitor
конденсатор - chip capacitor
- coupling capacitor
- decoupling capacitor
- diffused-junctioncapacitor
- diffusedcapacitor
- fixed capacitor
- floating capacitor
- flying capacitor
- groove capacitor
- IC capacitor
- isolation-merged capacitor
- junction capacitor
- memory capacitor
- MOS capacitor
- nitride capacitor
- stacked capacitor
- trench capacitor
- variable capacitor
- wafer capacitorEnglish-Ukrainian dictionary of microelectronics > capacitor
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13 region
область; зона; ділянка (див. т-ж area, zone) - active TEG GaInAs region
- alloyed region
- avalanche region
- barrier region
- border region
- boundary region
- breakdown region
- buried region
- channel region
- channel stopреr region
- channel stop region
- charge-transfer region
- collector region
- conduction region
- conductor region
- cutoff region
- deep-UV region
- degenerate region
- depletion mode region
- depletion region
- deuterons implanted region
- diffusion-isolated region
- drain region
- drift region
- D-well region
- encroaching region
- enhanced region
- epitaxial region
- exposed region
- extrinsic region
- field region
- floating region
- forbidden region
- gate region
- graded region
- heavily-doped region
- high-conductivity region
- high-impurity region
- high-resistivity region
- hydrogenated region
- impurity region
- inactive region
- infrared region
- injection region
- injector region
- inset region
- insulation region
- insulator region
- interface region
- intrinsic region
- ion-implanted region
- island region
- isolation region
- junction region
- low-impurity region
- low-resistivity region
- multiplication region
- n region
- narrow-gap region
- near-UV region
- n-tab region
- ohmic contact region
- p region
- peripheral region
- periphery region
- polysilicon-on-охide region
- proton-damaged region
- proton implanted region
- reach-through region
- recessed охide region
- recombination region
- self-aligned regions
- shallow region
- shield region
- silicon-sapphire interface region
- softening region
- source region
- spreading-resistance region
- stack regions
- stepped-doping region
- storage region
- strip-like region
- strip-shaped region
- Strongly n-type region
- subcollector region
- subthreshold region
- superlattice region
- tank region
- terminating region
- thermally grown охide region
- transfer region
- transit-time region
- ultraviolet region
- V-groove region
- weak inversion region
- well region
- wide-gap region -
14 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
См. также в других словарях:
groove isolation — izoliavimas grioveliais statusas T sritis radioelektronika atitikmenys: angl. groove isolation vok. Grabenisolation, f rus. изоляция канавками, f pranc. isolation par rainures, f … Radioelektronikos terminų žodynas
V-groove isolation — izoliavimas V grioveliais statusas T sritis radioelektronika atitikmenys: angl. V groove isolation vok. V Graben Isolation, f rus. изоляция V образными канавками, f pranc. isolation par rainures en V, f … Radioelektronikos terminų žodynas
V-groove isolation polycrystal backfill technique — izoliavimo polikristalinio silicio V grioveliais būdas statusas T sritis radioelektronika atitikmenys: angl. V groove isolation polycrystal backfill technique vok. Polysilizium V Graben Isolationstechnik, f rus. способ изоляции V образными… … Radioelektronikos terminų žodynas
V-groove isolation polycrystal backfill — izoliavimo V griovelių užpildymas polikristaliniu siliciu statusas T sritis radioelektronika atitikmenys: angl. V groove isolation polycrystal backfill vok. Ausfüllen von V Gräben mit isolierendem Polysilizium, n rus. заполнение V образных… … Radioelektronikos terminų žodynas
isolation par rainures en V — izoliavimas V grioveliais statusas T sritis radioelektronika atitikmenys: angl. V groove isolation vok. V Graben Isolation, f rus. изоляция V образными канавками, f pranc. isolation par rainures en V, f … Radioelektronikos terminų žodynas
isolation par rainures — izoliavimas grioveliais statusas T sritis radioelektronika atitikmenys: angl. groove isolation vok. Grabenisolation, f rus. изоляция канавками, f pranc. isolation par rainures, f … Radioelektronikos terminų žodynas
isolation groove — izoliuojamasis griovelis statusas T sritis radioelektronika atitikmenys: angl. isolation groove vok. Trennfuge, f rus. изолирующая канавка, f pranc. rainure d isolement, f … Radioelektronikos terminų žodynas
V-Graben-Isolation — izoliavimas V grioveliais statusas T sritis radioelektronika atitikmenys: angl. V groove isolation vok. V Graben Isolation, f rus. изоляция V образными канавками, f pranc. isolation par rainures en V, f … Radioelektronikos terminų žodynas
technique d'isolation par rainures en V à silicium polycristallin — izoliavimo polikristalinio silicio V grioveliais būdas statusas T sritis radioelektronika atitikmenys: angl. V groove isolation polycrystal backfill technique vok. Polysilizium V Graben Isolationstechnik, f rus. способ изоляции V образными… … Radioelektronikos terminų žodynas
V-groove integrated injection logic — loginis integrinis injekcinis V grioveliais izoliuotas grandynas statusas T sritis radioelektronika atitikmenys: angl. V groove integrated injection logic vok. integrierte V Graben Injektionslogik, f rus. интегральная инжекционная логическая… … Radioelektronikos terminų žodynas
logique intégrée à injection avec isolation par rainures en V — loginis integrinis injekcinis V grioveliais izoliuotas grandynas statusas T sritis radioelektronika atitikmenys: angl. V groove integrated injection logic vok. integrierte V Graben Injektionslogik, f rus. интегральная инжекционная логическая… … Radioelektronikos terminų žodynas